2022 South Asia Webinar Series

ZESTRON 2022 South Asia Webinar Series

ZESTRON Academy is pleased to invite you to participate our FREE Webinar Series.

All webinars begin at 3.00PM (MYS Time, GMT +8), with a 45 minutes presentation inclusive Q&A session.

Don’t miss the opportunity, join us now

pH Neutral Cleaning Agents Market Expectation and Field Performance

pH Neutral Cleaning Agents Market Expectation and Field Performance
July 1st

pH neutral product development in precision electronics cleaning applications was a major breakthrough in recent years. The impetus for this development is a result of changes in solder paste formulations and assembly processes. This webinar reviews the effectiveness of pH neutral cleaning agents as compared to alkaline cleaning agents, includes field data of the material compatibilities and cleaning performance.

How to select an appropriate cleaning system and process?

How to select an appropriate cleaning system and process?
September 23rd

Many electronic products are moving towards the trend of intelligence and miniaturization. Higher component integration has led to new challenges in product reliability, which requires higher cleaning standards. While the electronics cleaning process is not commonly employed, as a consequence the relevant knowledge and experience in the field is still lacking. This webinar analyzes the key factors to be considered prior to setting up the cleaning process.

Impact of high peak reflow temperature on flux removal of high Pb solder paste

Impact of high peak reflow temperature on flux removal of high Pb solder paste
November 25th

High power discrete packages such as MOSFET, smart power ASICs, IGBTs modules and integrated power modules, commonly use high Pb solder paste as die attach and interconnect material. The most common high Pb die attached materials are Pb92.5Sn5Ag2.5 and Pb95Sn5 which have a liquidus temperature of >300oC. Voids, caused by a lack of solder or poor wetting in the solder bonds, can be a serious problem for power devices. Usually process engineers increase the soldering profile peak temperature in order to reduce the voids. However, this leads to an increase in the flux activity during the reflow soldering process. This webinar shares the study about the impact of different peak reflow temperatures on cleaning effectiveness of discrete packages.

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